Moore’s Law states that the number of transistors per silicon chip will double every year. Since transistors are responsible for transmitting and processing data, the increase in transistors has significantly increased computing power, memory capacity, and even pixel density, bringing the cost of technology down and reducing power requirements.
While Moore’s Law has held up since its introduction in the 1960s, current technologies are starting to bump up against physics-based limitations—you can only fit so many transistors on a flat 2D microchip. These challenges are becoming particularly acute within complex circuitry elements, such as memories and RF or analog circuits.
Let’s look at how GBT Technologies Inc. (OTC Pink: GTCH) plans to address these challenges with 3D multi-planar microchips.
3D Microchips & Challenges
Imagine that you’re in charge of building a city with different roads connecting neighborhoods. As the population grows, making these connections increasingly difficult without introducing stoplights and causing congestion. As a result, you might decide to build a subway system and a highway system, making transportation “three-dimensional.”
Similarly, three-dimensional microchips have become the next big focus for semiconductor manufacturers. Rather than packing transistors on a 2D surface, these approaches involve stacking silicon wafers or dies and connecting them vertically using through-silicon VIAs. As a result, they behave like a single “device” but with a much smaller footprint.
Despite these breakthroughs, most 3D chip designs rely on traditional interconnection methods, such as wire bonding and flip-chip. While they may initially have greater performance than 2D chips, these approaches will run into the same issues as existing technologies. In other words, they provide little more than a Band-Aid solution to the problem.
GBT’s Multi-Planar Architecture
GBT Technologies has developed a multi-dimensional architecture capable of exponential silicon space growth, along with better routing and interconnections. In addition, the approach offers much higher silicon yield and utilization for memories, micro solar cells, and MEMS technologies, addressing critical shortcomings of conventional 3D chip architectures.
3D multi-planar chips could add more surface area to the same chip.
The company’s intellectual property covers the architecture, design, and method, as well as new concepts for memory technology. In layman’s terms, the IP could enable the creation of terabytes of memory using the same footprint as gigabytes today. And, the outperformance wouldn’t require any new breakthroughs in the manufacturing process (e.g., 2nm chips).
Currently, the company is focused on building strategic partnerships to complete a physical proof of concept and establish manufacturing guidelines to support mass production. Depending on the partnership details, the timeline for bringing the chips to market could be as short as 18 to 24 months—a relatively near-term opportunity.
Why Investors Should Care
The global semiconductor industry is worth nearly one-half trillion dollars per year. With the growth of Internet-of-Things and other technologies, the market could double to almost a trillion dollars by 2028. Following supply chain disruptions, the move to on-shore microchip manufacturing also provides an opportunity to embrace this kind of next-gen technology.
GBT Technologies Inc. (OTC Pink: GTCH) trades with a market capitalization of just $1.5 million.
For more information, visit the company’s website or download their investor presentation.